| Reactivity: | Human |
| Applications: | WB |
| Host Species: | Mouse |
| Isotype: | IgG1 kappa |
| Clonality: | Monoclonal antibody |
| Gene Name: | BH3 interacting domain death agonist |
| Gene Symbol: | BID |
| Synonyms: | FP497 |
| Gene ID: | 637 |
| UniProt ID: | P55957 |
| Clone ID: | 24GB7035 |
| Immunogen: | Recombinant protein of human BID |
| Dilution: | WB 1:1,000-1:5,000 |
| Purification Method: | Affinity purified |
| Concentration: | Lot dependent |
| Buffer: | PBS with 0.05% proclin300, 50% glycerol, pH7.3. |
| Storage: | Store at -20°C. Avoid freeze/thaw cycles. |
Background
This gene BID encodes a death agonist that heterodimerizes with either agonist BAX or antagonist BCL2, and thus regulate apoptosis. The encoded protein is a member of the BCL-2 family of cell death regulators. It is a mediator of mitochondrial damage induced by caspase-8 (CASP8); CASP8 cleaves this encoded protein, and the COOH-terminal part translocates to mitochondria where it triggers cytochrome c release. Multiple alternatively spliced transcript variants have been found.
Images
![]() | Western blotting analysis using anti-BH3 interacting domain death agonist antibody (Cat#63712). Total cell lysates (30 μg) from various cell lines were loaded and separated by SDS-PAGE. The blot was incubated with anti-BH3 interacting domain death agonist antibody (Cat#63712, 1:5,000) and HRP-conjugated goat anti-mouse secondary antibody (Cat#101, 1:20,000) respectively. Image was developed using FeQ™ ECL Substrate Kit (Cat#226). |
![]() | Western blotting analysis using anti-BH3 interacting domain death agonist antibody (Cat#63712). BH3 interacting domain death agonist expression in wild-type (WT) and BH3 interacting domain death agonist (BID) shRNA knockdown (KD) HeLa cells with 20 μg of total cell lysates. Hsp90 α serves as a loading control. The blot was incubated with anti-BH3 interacting domain death agonist antibody (Cat#63712, 1:5,000) and HRP-conjugated goat anti-mouse secondary antibody (Cat#101, 1:20,000) respectively. Image was developed using FeQ™ ECL Substrate Kit (Cat#226). |
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